Japanese mobile phone and internet company Softbank is to issue Y130bn (US$1.5bn) in bonds next month, according to a statement to the Nikkei stock exchange.
The three-year bond was priced to yield in the 1%-1.5% range, said Softbank as quoted by Dow…
Japanese mobile phone and internet company Softbank is to issue Y130bn (US$1.5bn) in bonds next month, according to a statement to the Nikkei stock exchange.
The three-year bond was priced to yield in the 1%-1.5% range, said Softbank as quoted by Dow Jones Newswires. Reports explained that the company is taking advantage of current low interest rates to raise funding.
The money is expected to cover the redemption of bonds it issued in the past. Softbank is also planning to spend Y400bn (US$4.7bn) in capital expenditures this fiscal year, up from 79% in 2009, in order build new stations to accommodate a surge in data traffic from the iPhone, wrote media reports.
