The trend of sustainability bonds in connectivity is moving into Asia with SoftBank (TYO:9984) disclosing that it will issue a $263 million bond to fund a high-altitude platform (HAP) for mobile connectivity Jan. 27. Meanwhile, Taiwan-based telecom company Chunghwa Telecom Co. (NYSE:CHT; TAIEX:2412) announced today that it plans to raise a $363 million sustainability bond […]