Japanese telecoms group Softbank will skip a planned bond issue because of poor market conditions, according to Dow Jones citing local publication Nikkei.
The company was reportedly expected to release the terms of this issue – which would have…
Japanese telecoms group Softbank will skip a planned bond issue because of poor market conditions, according to Dow Jones citing local publication Nikkei.
The company was reportedly expected to release the terms of this issue – which would have consisted of three-, five- and seven-year corporate bonds – at the end of the week.
Nomura Securities had been appointed as lead underwriter. Softbank was not immediately available for comment.
Early this year, the company issued Y50bn (US$571.7m) worth of two-year bonds.
